Rumored Specs and Details of the Upcoming iPhone 6 and Galaxy S5 Explained by Korean Analyst

Rumored Specs and Details of the Upcoming iPhone 6 and Galaxy S5 Explained by Korean Analyst

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A new angle on the details and specs we can expect from this year’s most anticipated smartphones, Apple’s iPhone 6 and the Galaxy S5 by Samsung, emerged, this time from the South Korean based analyst, KDB Daewoo Securities.

GalaxyS5 iPhone 6

While there are a lot of leaked stuff on the details on the 2 anticipated flagship devices of both Apple and Samsung, this new angle is just merely making previous leaks more plausible. First is for the future of Apple’s iPhone. On the pdf file from KDB Daewoo Securities, it seems like the iPhone is really coming in with 2 different screen sizes this year, a 4.8 inch one, possibly named as the iPhone 6, and a 5.5 inch iPhone phablet.

Based on the document, the 4.8 inch iPhone will feature a resolution of 1920 x 1080 pixels at 440 ppi, while the bigger 5.5 inch phablet will sport 2k display with a resolution of 2272 x 1280 pixels. There’s also a 2 GB worth of RAM and a 128 GB option for the built in storage. The upcoming iPhone is also said to sport the same 8 megapixel camera, but with better optics, 3.2 megapixel Facetime camera and a 1800 mAh battery. Contrary to what we’re all expecting, Apple will launch iOS 7.2, instead of iOS 8.

iPhone 6 and S5

As for the Samsung Galaxy S5, the leaked document suggests either a 2.5GHz Snapdragon processor or a 2GHz octa core Exynos 64-bit chip on the device, opposing KGI analyst Ming-Chi Kuo’s claims that the Galaxy S5 will only come with a 32-bit chip. There’s also a 3GB of RAM, 128 GB ROM variant, 16 megapixel and 3.2 megapixel back and front cameras, as well as a 3,200 mAh battery. KDB Daewoo Securities also failed to mention the inclusion of an embedded fingerprint biometrics support, just like what KGI suggested.

But of course, rumors are just rumors. Until these 2 very anticipated devices gets officially announced, we’re all just hopeful. [via]

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